Design for reliability. Measure what matters
Modern electronics depend on materials that must perform reliably through semiconductor processing, advanced packaging, and final assembly. From semiconductor process materials used in lithography and chemical mechanical planarization to advanced packaging materials such as underfills and encapsulants, along with printed circuit boards and thermal interface materials, small changes in thermal, mechanical, rheological, or dimensional properties can affect yield, reliability, and long-term performance.
TA Instruments provides advanced materials metrology solutions for characterizing electronic materials across the product lifecycle. Our thermal analysis, rheology, thermal conductivity, dynamic mechanical analysis, thermomechanical analysis, and mechanical testing platforms help scientists and engineers quantify cure behavior, viscosity, modulus, glass transition, thermal stability, coefficient of thermal expansion, thermal conductivity, and fatigue performance.
These insights help manufacturers optimize formulations, control incoming material quality, improve process windows, and reduce reliability risks from the wafer fab to final electronic assembly.
Application Solutions
Control Flow, Planarity, and Mechanical Stability in Wafer Processing
Semiconductor process materials such as CMP pads, polishing slurries, photoresists, and lithography polymers must meet tight performance windows for coating, polishing, patterning, and defect control. Their rheological, thermal, and mechanical properties influence slurry transport, pad-wafer contact mechanics, film uniformity, bake behavior, and process repeatability. TA Instruments helps characterize these critical materials through rheology, dynamic mechanical analysis, thermal analysis, and thermomechanical testing to support formulation development, process optimization, and quality control.
Measures flow, viscosity, yield stress, and viscoelastic behavior of slurries, photoresists, and process polymers.
Properties
- Viscosity vs. shear rate
- Yield stress
- Thixotropic recovery
- Oscillatory modulus
- Temperature-dependent flow behavior
Dynamic Mechanical Analysis (DMA)
Quantifies viscoelastic properties of CMP pads, films, and cured process polymers under temperature, frequency, and humidity conditions.
Properties
- Storage modulus
- Loss modulus
- Tan delta
- Glass transition temperature
- Creep/stress relaxation
- Humidity-dependent modulus
Differential Scanning Calorimetry (DSC)
Measures thermal transitions and cure behavior in photoresists, dielectric polymers, coatings, and process materials.
Properties
- Glass transition temperature
- Cure onset and peak temperature
- Residual cure/reaction enthalpy
- Melting or crystallization behavior
- Heat capacity changes
Thermogravimetric Analysis (TGA)
Evaluates thermal stability, solvent loss, residue, and decomposition behavior of process polymers, slurries, and photoresist-related materials.
Properties
- Weight loss profile
- Solvent/volatile content
- Decomposition onset
- Residual inorganic content
- Oxidation stability
Ensure Dimensional Stability and Thermal Reliability
Printed circuit boards, flexible substrates, laminates, and polyimide films form the foundation of electronic assemblies. Variations in glass transition temperature, coefficient of thermal expansion, modulus, thermal stability, and moisture-driven dimensional change can contribute to warpage, delamination, cracked vias, and reliability failures. TA Instruments helps characterize these materials using TMA, DMA, DSC, TGA, and mechanical testing to support material selection, process control, and long-term reliability.
Thermomechanical Analysis (TMA)
Measures Coefficient of Thermal Expansion (CTE) to predict warpage and delamination risks between mismatched layers.
Properties
- Dimensional change vs temperature
- CTE (in-plane/through-thickness)
- Time to delamination
- Softening points
- Glass transition temperature (Tg)
- Humidity-dependent dimensional change, when equipped for RH control
Dynamic Mechanical Analysis (DMA)
Quantifies modulus and viscoelastic properties to ensure mechanical stability under thermal and humidity stress.
Properties
- Storage modulus
- Secondary transitions
- Glass transition temperature (Tg)
- Stress relaxation and creep
Differential Scanning Calorimetry (DSC)
Determines thermal transitions to validate Tg and cure behavior in substrates.
Properties
- Glass transition temperature (Tg)
- Melting point
- Enthalpy change
- Cure progression and kinetics
Thermogravimetric Analysis (TGA)
Measures thermal stability and decomposition for substrate materials.
Properties
- Weight loss events
- Decomposition onset
- Residual filler/ash content
Performs tensile, fatigue, and cyclic loading tests to validate mechanical durability of PCB laminates and flexible substrates under operational stress.
Properties
- Tensile strength and modulus
- Fatigue life under cyclic loading
- Fracture toughness
- Dynamic mechanical response under thermal conditions
Optimize Cure, Flow, and Bond Reliability
Electronic adhesives, underfills, encapsulants, and conformal coatings must flow predictably, cure completely, and maintain mechanical integrity through thermal cycling, humidity exposure, and mechanical stress. Incomplete cure, poor dispensing behavior, residual exotherm, CTE mismatch, or modulus changes can lead to voids, delamination, cracking, and package failure. TA Instruments provides rheology, DSC, DMA, TMA, and TGA solutions to help optimize formulation, dispensing, cure schedules, and long-term reliability.
Differential Scanning Calorimetry (DSC)
Track cure progression and degree of cure for epoxies, underfills and encapsulants.
Properties
- Onset and peak cure temperature
- Degree of cure (residual exotherm)
- Cure kinetics
- Enthalpy change
- Glass transition temperature (Tg)
Measures viscosity, yield stress, thixotropy, and gelation behavior to optimize dispensing, jetting, pot life, and cure processing.
Properties
- Gel point/time
- Viscosity profile
- Cure kinetics under UV or heat
- Yield stress and thixotropic recovery
Thermomechanical Analysis (TMA)
Validates dimensional stability and thermal expansion mismatch.
Properties
- CTE
- Softening points
- Swelling/shrinkage under humidity
Dynamic Mechanical Analysis (DMA)
Measures modulus and mechanical integrity post-cure.
Properties
- Storage modulus
- Glass transition temperature (Tg)
- Stress relaxation
Thermogravimetric Analysis (TGA)
Measures thermal stability, volatile loss, and filler or residue content in adhesives, underfills, and encapsulants.
Properties
- Decomposition onset
- Weight loss / volatiles
- Residual filler content
- Oxidation stability
Manage Heat with Confidence
Thermal interface materials, including greases, gels, pads, gap fillers, phase-change materials, and thermal adhesives, are critical for transferring heat between electronic components and heat spreaders. Their performance depends on thermal conductivity, phase-change behavior, filler loading, flow, compliance, and mechanical stability under compression, shear, and thermal cycling. TA Instruments provides thermal conductivity, DSC, TGA, DMA, and rheology solutions to help optimize heat dissipation, processability, and long-term reliability.
DTC 300 – Thermal Conductivity Analyzer Rheology
Measures thermal diffusivity and conductivity to ensure efficient heat dissipation in electronics.
Properties
- Thermal diffusivity
- Thermal conductivity
- Specific heat capacity
Dynamic Mechanical Analysis (DMA)
Quantifies compliance under compression and shear for TIMs.
Properties
- Modulus under compression
- Shear stiffness
- Phase-change softening
Differential Scanning Calorimetry (DSC)
Detects phase-change transitions and enthalpy for thermal pads, greases and pastes.
Properties
- Melting point
- Heat capacity
- Latent heat
- Phase-change behavior and transitions
Thermogravimetric Analysis (TGA)
Assesses thermal stability and filler content in TIMs.
Properties
- Decomposition onset
- Residual filler content
Evaluates flow and yield stress for dispensable TIMs.
Properties
- Yield stress
- Viscosity profile
- Thixotropic recovery
Optimize Reflow, Printability, and Joint Reliability
Solder alloys, solder pastes, flux systems, and conductive adhesives must meet tight requirements for melting behavior, printability, slump resistance, residue formation, and thermal stability. TA Instruments helps characterize reflow behavior, flux volatilization, oxidation, residue content, viscosity, yield stress, and thixotropic recovery to support cleaner processing, consistent deposition, and reliable electrical and mechanical connection.
Thermogravimetric Analysis (TGA)
Quantify flux burn‑off, oxidation, and residue in solder pastes for cleaner, void‑free joints.
Properties
- Weight loss profile
- Ash %
- Metal loading estimate
- Oxidation onset/stability
Differential Scanning Calorimetry (DSC)
Measures melting and heat-flow behavior of solder alloys and solder pastes to support reflow profile development.
Properties
- Melting range
- Heat of fusion
- Reflow thermal events
- Oxidation or reaction events, where applicable
Evaluates solder paste and conductive adhesive flow behavior for stencil printing, dispensing, jetting, slump control, and shelf-life studies.
Properties
- Viscosity vs shear rate (jetting windows)
- Yield stress and slump control
- Thixotropic recovery
- Pot life/gel time
- Process Materials
-
Control Flow, Planarity, and Mechanical Stability in Wafer Processing
Semiconductor process materials such as CMP pads, polishing slurries, photoresists, and lithography polymers must meet tight performance windows for coating, polishing, patterning, and defect control. Their rheological, thermal, and mechanical properties influence slurry transport, pad-wafer contact mechanics, film uniformity, bake behavior, and process repeatability. TA Instruments helps characterize these critical materials through rheology, dynamic mechanical analysis, thermal analysis, and thermomechanical testing to support formulation development, process optimization, and quality control.
Measures flow, viscosity, yield stress, and viscoelastic behavior of slurries, photoresists, and process polymers.
Properties
- Viscosity vs. shear rate
- Yield stress
- Thixotropic recovery
- Oscillatory modulus
- Temperature-dependent flow behavior
Dynamic Mechanical Analysis (DMA)
Quantifies viscoelastic properties of CMP pads, films, and cured process polymers under temperature, frequency, and humidity conditions.
Properties
- Storage modulus
- Loss modulus
- Tan delta
- Glass transition temperature
- Creep/stress relaxation
- Humidity-dependent modulus
Differential Scanning Calorimetry (DSC)
Measures thermal transitions and cure behavior in photoresists, dielectric polymers, coatings, and process materials.
Properties
- Glass transition temperature
- Cure onset and peak temperature
- Residual cure/reaction enthalpy
- Melting or crystallization behavior
- Heat capacity changes
Thermogravimetric Analysis (TGA)
Evaluates thermal stability, solvent loss, residue, and decomposition behavior of process polymers, slurries, and photoresist-related materials.
Properties
- Weight loss profile
- Solvent/volatile content
- Decomposition onset
- Residual inorganic content
- Oxidation stability
- PCB's & Substrates
-
Ensure Dimensional Stability and Thermal Reliability
Printed circuit boards, flexible substrates, laminates, and polyimide films form the foundation of electronic assemblies. Variations in glass transition temperature, coefficient of thermal expansion, modulus, thermal stability, and moisture-driven dimensional change can contribute to warpage, delamination, cracked vias, and reliability failures. TA Instruments helps characterize these materials using TMA, DMA, DSC, TGA, and mechanical testing to support material selection, process control, and long-term reliability.
Thermomechanical Analysis (TMA)
Measures Coefficient of Thermal Expansion (CTE) to predict warpage and delamination risks between mismatched layers.
Properties
- Dimensional change vs temperature
- CTE (in-plane/through-thickness)
- Time to delamination
- Softening points
- Glass transition temperature (Tg)
- Humidity-dependent dimensional change, when equipped for RH control
Dynamic Mechanical Analysis (DMA)
Quantifies modulus and viscoelastic properties to ensure mechanical stability under thermal and humidity stress.
Properties
- Storage modulus
- Secondary transitions
- Glass transition temperature (Tg)
- Stress relaxation and creep
Differential Scanning Calorimetry (DSC)
Determines thermal transitions to validate Tg and cure behavior in substrates.
Properties
- Glass transition temperature (Tg)
- Melting point
- Enthalpy change
- Cure progression and kinetics
Thermogravimetric Analysis (TGA)
Measures thermal stability and decomposition for substrate materials.
Properties
- Weight loss events
- Decomposition onset
- Residual filler/ash content
Performs tensile, fatigue, and cyclic loading tests to validate mechanical durability of PCB laminates and flexible substrates under operational stress.
Properties
- Tensile strength and modulus
- Fatigue life under cyclic loading
- Fracture toughness
- Dynamic mechanical response under thermal conditions
- Structural Adhesives
-
Optimize Cure, Flow, and Bond Reliability
Electronic adhesives, underfills, encapsulants, and conformal coatings must flow predictably, cure completely, and maintain mechanical integrity through thermal cycling, humidity exposure, and mechanical stress. Incomplete cure, poor dispensing behavior, residual exotherm, CTE mismatch, or modulus changes can lead to voids, delamination, cracking, and package failure. TA Instruments provides rheology, DSC, DMA, TMA, and TGA solutions to help optimize formulation, dispensing, cure schedules, and long-term reliability.
Differential Scanning Calorimetry (DSC)
Track cure progression and degree of cure for epoxies, underfills and encapsulants.
Properties
- Onset and peak cure temperature
- Degree of cure (residual exotherm)
- Cure kinetics
- Enthalpy change
- Glass transition temperature (Tg)
Measures viscosity, yield stress, thixotropy, and gelation behavior to optimize dispensing, jetting, pot life, and cure processing.
Properties
- Gel point/time
- Viscosity profile
- Cure kinetics under UV or heat
- Yield stress and thixotropic recovery
Thermomechanical Analysis (TMA)
Validates dimensional stability and thermal expansion mismatch.
Properties
- CTE
- Softening points
- Swelling/shrinkage under humidity
Dynamic Mechanical Analysis (DMA)
Measures modulus and mechanical integrity post-cure.
Properties
- Storage modulus
- Glass transition temperature (Tg)
- Stress relaxation
Thermogravimetric Analysis (TGA)
Measures thermal stability, volatile loss, and filler or residue content in adhesives, underfills, and encapsulants.
Properties
- Decomposition onset
- Weight loss / volatiles
- Residual filler content
- Oxidation stability
- TIMs
-
Manage Heat with Confidence
Thermal interface materials, including greases, gels, pads, gap fillers, phase-change materials, and thermal adhesives, are critical for transferring heat between electronic components and heat spreaders. Their performance depends on thermal conductivity, phase-change behavior, filler loading, flow, compliance, and mechanical stability under compression, shear, and thermal cycling. TA Instruments provides thermal conductivity, DSC, TGA, DMA, and rheology solutions to help optimize heat dissipation, processability, and long-term reliability.
DTC 300 – Thermal Conductivity Analyzer Rheology
Measures thermal diffusivity and conductivity to ensure efficient heat dissipation in electronics.
Properties
- Thermal diffusivity
- Thermal conductivity
- Specific heat capacity
Dynamic Mechanical Analysis (DMA)
Quantifies compliance under compression and shear for TIMs.
Properties
- Modulus under compression
- Shear stiffness
- Phase-change softening
Differential Scanning Calorimetry (DSC)
Detects phase-change transitions and enthalpy for thermal pads, greases and pastes.
Properties
- Melting point
- Heat capacity
- Latent heat
- Phase-change behavior and transitions
Thermogravimetric Analysis (TGA)
Assesses thermal stability and filler content in TIMs.
Properties
- Decomposition onset
- Residual filler content
Evaluates flow and yield stress for dispensable TIMs.
Properties
- Yield stress
- Viscosity profile
- Thixotropic recovery
- Solders
-
Optimize Reflow, Printability, and Joint Reliability
Solder alloys, solder pastes, flux systems, and conductive adhesives must meet tight requirements for melting behavior, printability, slump resistance, residue formation, and thermal stability. TA Instruments helps characterize reflow behavior, flux volatilization, oxidation, residue content, viscosity, yield stress, and thixotropic recovery to support cleaner processing, consistent deposition, and reliable electrical and mechanical connection.
Thermogravimetric Analysis (TGA)
Quantify flux burn‑off, oxidation, and residue in solder pastes for cleaner, void‑free joints.
Properties
- Weight loss profile
- Ash %
- Metal loading estimate
- Oxidation onset/stability
Differential Scanning Calorimetry (DSC)
Measures melting and heat-flow behavior of solder alloys and solder pastes to support reflow profile development.
Properties
- Melting range
- Heat of fusion
- Reflow thermal events
- Oxidation or reaction events, where applicable
Evaluates solder paste and conductive adhesive flow behavior for stencil printing, dispensing, jetting, slump control, and shelf-life studies.
Properties
- Viscosity vs shear rate (jetting windows)
- Yield stress and slump control
- Thixotropic recovery
- Pot life/gel time
Electronics Applications
Printed circuit boards and dielectric materials experience repeated thermal excursions during solder reflow. Differences in coefficient of thermal expansion, residual stress, moisture uptake, and incomplete cure can lead to dimensional instability, delamination, cracked vias, or board warpage. Cyclic TMA testing helps simulate reflow-like thermal exposure and detect early signs of expansion, drift, or delamination before assembly failures occur.
Questions this test helps answer:
- Does the material remain dimensionally stable during reflow-like thermal exposure?
- Is there evidence of expansion, softening, or delamination during the thermal hold?
- Can the material withstand repeated thermal cycles without excessive dimensional change?
- Are there lot-to-lot differences that could increase warpage or reliability risk?
Learn More: A New Cyclic TMA Test Protocol for Evaluation of Electronic and Dielectric Materials
Polyimide films are widely used in flexible printed circuits, high-density interconnects, sensors, aerospace wiring, and power electronics because of their thermal stability and mechanical durability. However, elevated temperatures can change modulus, dimensional stability, and elongation behavior. Combining DMA and TMA measurements helps evaluate glass transition behavior, modulus retention, and dimensional change to define the safe operating window for high-temperature applications.
Questions this test helps answer:
- At what temperature does the film begin to lose mechanical stiffness?
- Does the material maintain modulus within the expected application temperature range?
- How much dimensional change occurs during heating?
- What is the maximum allowable elongation before mechanical reliability becomes a concern?
- Is the film suitable for flexible PCB or high-temperature electronic assemblies?
Learn More: Thermo-Mechanical Properties of Polyimide Films for High Temperature Applications
Thermal interface materials must conform to surfaces, maintain contact, and transfer heat efficiently under compression, shear, and thermal cycling. Materials that are too stiff may lose intimate contact, while materials that are too compliant may deform, pump out, or show inconsistent performance. DMA testing helps quantify stiffness and viscoelastic response under different deformation modes, supporting TIM selection and reliability assessment for demanding electronic assemblies.
Questions this test helps answer:
- Does the TIM maintain sufficient compliance under compression and shear?
- How does modulus change with frequency, temperature, or deformation mode?
- Is the material likely to maintain contact during thermal cycling?
- Could material selection or design changes reduce the risk of contact loss?
- Which TIM formulation provides the best balance of compliance and mechanical stability?
Learn More: Complex Mechanical Behavior of Thermal Interface Materials: Silicone and Polyurethane Foams – TA Instruments
Webinars
Resources
Application Notes
- Complex Mechanical Behavior of Thermal Interface Materials: Silicone and Polyurethane Foams
- Thermo-Mechanical Properties of Polyimide Films for High Temperature Applications
- Simultaneous Rheology-Dielectric Measurements of Epoxy Curing
- A New Cyclic TMA Test Protocol for Evaluation of Electronic and Dielectric Materials
- Characterization of Printed Circuit Board Materials by DMA
- Thermal Analysis of Phase Change Materials – Three Organic Waxes using TGA, DSC, and Modulated DSC®
- Advanced Thermal Analysis of Phase Change Materials – Three Organic Waxes using Modulated TGATM and Modulated DSC®
- Characterization of Epoxy Prepregs by DSC
- Predicting Printed Circuit Board Delamination
- View all Application Notes