Five Essential Testing Techniques for Your Electronics Adhesives, Tims, and PI Films

Modern electronics are thinner, hotter, and more flexible than ever, putting enormous pressure on the materials quietly holding everything together. This eBook reveals how three essential material classes shape device performance: pressure sensitive adhesives, thermal interface materials, and high temperature polyimide films.

What You’ll Learn

Across three real world use cases from TA Instruments, you’ll see how to connect measurable material properties to meaningful product outcomes:

• PSAs for displays and modules: Improve adhesion, reduce contamination, and streamline assembly.
• TIM foams for thermal gap filling: Enhance heat flow, reduce hotspots, and boost reliability.
• Polyimide films for flexible circuits: Maintain stability under heat, bending, and long term mechanical stress.

You’ll also discover how techniques like DSC, DMA, TMA, TGA, and rheology help you quantify performance so you can design with confidence.

Complete the form to the right for immediate access to this valuable resource.